90% of semiconductor packaging, assembly and test plants to locate in Asia-Pacific

The semiconductor packaging, assembly and test industry continues to undergo consolidation and divestitures of facilities among its players. Nearly 90% of all planned facilities will be located in Asia/Pacific; more than 60% of these will be in China, Gartner said.

The semiconductor packaging, assembly and test industry continues to undergo consolidation and divestitures of facilities among its players. Nearly 90% of all planned facilities will be located in Asia/Pacific; more than 60% of these will be in China, Gartner said.

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