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​Samsung, SAP to cooperate on next-gen in-memory platforms

Samsung Electronics and SAP have opened a joint research centre that will develop memory solutions for next-generation in-memory computing.
Written by Cho Mu-Hyun, Contributing Writer

Samsung Electronics and SAP will work together to develop in-memory platforms that will substantially increase processing for next-generation computing, the companies have announced.

The in-memory database allows the saving of massive amounts of data on the main memory of a device that processes information of the CPU. It also allows for a faster data processing speed.

The firms set a joint research centre at Samsung's Hwaseong campus, where its device solution, or semiconductor, research labs are located. They will start co-development next month.

At the centre, the two firms will provide customers with optimized solutions through extensive test runs of the SAP HANA and review of Samsung's memory solutions, the companies said.

The server system at the centre uses a 24-terabyte in-memory platform based on Samsung's 128GB DDR4 3DS (three-dimensionally stacked) DRAM modules, made from 20-nanometer process. Next year, the companies will put in 256GB 3DS DRAM modules to further enhance the system, they said.

They will increase performance and energy efficiency of solutions to provide customers high return-on-investment rates, they added.

"With our latest 10nm-class DRAM technology, Samsung Electronics will be able to provide more advanced solutions for SAP's next-generation in-memory system in a highly efficient manner" said Jun Young-hyun, Samsung's memory boss, in a statement. "Samsung will continue solidifying its technology leadership in the high-density memory market through ongoing innovation.

"Together with Samsung Electronics, we will develop the next generation of in-memory solutions for customers using the SAP HANA platform. This collaboration with Samsung extends our partnership and represents our commitment to drive innovation and help our customers win in the digital economy," said Adaire Fox-Martin, president for SAP Asia Pacific Japan.

Samsung, the world's largest memory chip maker, and SAP agreed to co-develop technologies for the latter's in-memory platform, SAP HANA, in 2015.

After cooperation began between the Samsung's memory division and SAP Labs Korea in June last year, the two agreed to set a joint lab to develop high-speed, high-memory DRAM modules and in-memory technologies

Samsung earlier this month updated its VNAND SSDs, by adding two new products that support NVMe protocol.

Samsung SDS, the group's IT service affiliate, partnered with SAP in June to spread cloud in Asia.

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