Intel's two-way punch knocks out 45nm chips

Intel's two-way punch knocks out 45nm chips

Summary: As chip features edge ever closer to the limits of physics, new problems threaten to slow down development. Intel's answer: introduce two inventions at once

TOPICS: Emerging Tech

...have a dielectric constant, also called kappa or ĸ, that describes how well they can concentrate electrical charge. An insulator with a higher ĸ than silicon can be made in a thicker layer while still passing on the effects of the electrons in the gate as well or better than before.

The good news is that there are hundreds if not thousands of high-ĸ materials: the bad news is that very few are compatible with existing silicon chip fabrication techniques. One of the rules of the game is that you change as little as possible between generations: 40 years into the technology, everything rests on an extremely finely tuned set of exquisitely sensitive processes that can mass produce enormous numbers of components — and any single change can have complex effects. About five years ago, for example, manufacturers moved from aluminium interconnections on chip to copper. The physics was impeccable and the move necessary, and the new chips worked fine. What the industry didn't know was the effect on non-copper production of contamination from the new lines. It was eventually realised that extreme care had to be taken to avoid any movement of production equipment between copper and non-copper areas, but only after painful drops in fabrication-line yield.

So any high-ĸ dielectric has to be easy to integrate with existing production. Unfortunately, there appears to be none that can be dropped in as a straight replacement for silicon dioxide: some of the most promising, including compounds such as hafnium-silicate oxynitride (HfSiON), do not interface well with polysilicon: electron behaviour at the junction between the materials is restricted, raising the voltage that the transistor needs to work at and introducing other undesirable side effects.

Intel has thus decided to replace the gate material as well, changing the polysilicon for metal. Metal has plenty of advantages over polysilicon — the original designs of CMOS transistors used metal gates, hence the M in the name — but was abandoned early on because polysilicon was far easier to integrate into the rest of the manufacturing process. Nonetheless, metal-gate transistors work faster and take less power; in Intel's eyes, combining that with the ability to use high-ĸ dielectrics overcomes the downside of more complicated production. The company claims that the changes taken together mean that gate leakage is down by a factor of 10, source-drain leakage by a factor of five, and active switching power down by 30 percent. At the moment, however, it is giving no details beyond the bare fact that it is using metal gates with a hafnium-based insulator — and the details are where the interest lies.

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There are other ways to go. Texas Instruments says it can scale to 45nm by extending existing techniques, most notably by straining the silicon atomic lattice to change its electrical characteristics, while there are plenty of alternatives for using high-ĸ dielectrics without metal gates, and metal gates without high-ĸ dielectrics. The winner will be the company that can overcome the inevitable production difficulties that come with any change of technology; by taking two changes at once, Intel is raising the stakes.

Further down the line, 32nm is already being planned by chip manufacturers keen to deliver even higher performance with even smaller chip architectures. This will require further changes across the board, with designers looking at radically different transistor configurations — and there's no guarantee that Intel's chosen path will be the one best positioned to take the next step. Other aspects of production will also have to be revisited: IBM has said its 45nm process will use wet lithography — where chips are exposed underwater to the patterns of light that define their circuit, to shrink the image further — while Intel is still using dry lithography. Intel may have to move to wet for 32nm. If anything, though, the roadmap through 32nm to 22nm and beyond is arriving sooner than expected, with the scene being set for the massively multicore chips of the next decade — and whatever software they may end up running.

Topic: Emerging Tech

Rupert Goodwins

About Rupert Goodwins

Rupert started off as a nerdy lad expecting to be an electronics engineer, but having tried it for a while discovered that journalism was more fun. He ended up on PC Magazine in the early '90s, before that evolved into ZDNet UK - and Rupert evolved with them into an online journalist.

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