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Intel's 300-millimeter wafer
A 300-millimeter wafer containing test SRAM chips made on the 45-nanometer process. The manufacturing technique will be used in mass manufacturing late next year. The test chips typically come out just under two years before mass manufacturing.
Intel's 45-nanometer test chip
It can hold 153 megabits of memory. The top third consists of memory cells. The middle section contains circuits for input/output and other functions. Those transistors are made so that Intel can test how different transistors come out on the new process. The bottom part is a tester.