3 of 6Image
Fab 36 gets the hook-up
Tool hook-up still in progress in March 2005 in AMD's chip fabrication plant. The Fab 36 equipment includes antivibration systems and chemical deposition machines.
Robot on the ceiling
The robot on the ceiling track is carrying a Forward Opening Unified Pod (FOUP), moving wafers from one section of the fab to another.
Packing the wafers for transport
This will be loaded onto one of the robots that handle wafer distribution and can conduct the task with less disruption than humans.