Micron will begin production for the first chip to use through-silicon vias (TSVs), IBM's 3D chip making process.
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The "Esther" processor that IBM Microelectronics is making for Via Technologies is another step in Big Blue's plan to become the helping hand to chipmakers in need.
IBM says it will manufacture power-management chips for Intersil next year, in a continued effort by Big Blue to become a big brother to smaller chipmakers.
The company plans to come out with server chips tailored for every taste and budget in 2003, in a bid to take market share from other chipmakers such as Sun Microsystems and IBM.
IBM Microelectronics Vice President Chris King is leaving the company to become chief executive of AMI Semiconductor, an Idaho-based chipmaker.
IBM gets investing in global chip manufacture
IBM Corp. will make capital investments worth$5 billion to support its semiconductor business aroundthe world, expanding facilities in Vermont and Japan,and building a new chip-making plant in New York.