Intel shows off new 22-nanometer wafer Summary: At the Intel Developer Forum in San Francisco, Intel CEO Paul Otellini shows off a silicon wafer housing chips made with 22-nanometer process technology. Chips made on that process will be ready for market in 2011. September 22, 2009 -- 12:29 GMT (05:29 PDT) Loading... Please wait. Topics: Intel, Hardware, Networking, Processors Kick off your day with ZDNet's daily email newsletter. It's the freshest tech news and opinion, served hot. Get it.