Big Blue boffins boost 3G chips

One small step for wireless devices...

IBM has made a breakthrough in developing components for wireless devices. The components, called Micro Electro Mechanical Systems (MEMS), are especially suitable to be used in 3G mobile phones because they feature tuners which help find the right frequency. The MEMS are installed inside the device's chip. MEMS can also help to provide faster data transfer because they enhance the processing power of the chip.