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The Microsoft Kin Two teardown

The super folks at iFixit have got their hands on Microsoft's Kin Two handset and, as usual, have taken it to bits.

The super folks at iFixit have got their hands on Microsoft's Kin Two handset and, as usual, have taken it to bits.

The highlights:

  • The Kin Two is 19.05 mm thick, which means that it makes a bigger bulge in the pants compared to the iPhone and Motorola Droid which are 12.3 mm and 13.7 mm thick, respectively.
  • The Kin Two has two very cool-looking springs that keep the phone's halves either fully-open or fully-closed.

  • The processor is an NVIDIA Tegra unit.

  • The 8 megapixels camera only takes up about .5 cm3 of space inside the Kin.
  • The digitizer is a Synaptics T1021A1 0939 ACOM755.
  • Storage comes in the form of a Samsung's moviNAND KLM8G4DEDD package supplies the 8GB. This is build on advanced 30nm architecture, and can manage a data transfer rate of up to 52 MB/s.
  • There are two Avago chips inside the Kin Two: an ACFM-7103 CS/Cellular/S-GPS Qunitplexer and an ACPM-7353 dual-band power amplifier.

  • The camera is the Sony IMX046.
  • The accelerometer is an STMicro 331DL 3 Axis nano MEMS (microelectromechanical systems) device.

All images courtesy of iFixit and Chipworks.