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The two companies are working together on adhesives that can glue chips on top of one another to increase density, while radiating heat away to maintain performance
IBM and 3M have announced a collaboration to develop semiconductor packaging processes and adhesives that create stacks of chips, aiming to increase density and performance.
In theory, the technique would allow 100 chips to be stacked on top of one another without overheating, IBM and 3M said in a joint statement on Wednesday. The companies believe this could lead to a 1,000-fold increase in performance.
3M plans to create new types of adhesives that can radiate heat efficiently while holding silicon together. IBM, meanwhile, will work on semiconductor packaging methods to let the stacked chips use shared memory and networking technologies, which should allow performance to climb and aggregate power consumption to fall.
Caption by: Jack Clark
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