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  • 300mm wafer

    300mm wafer

    A 300-millimeter wafer containing test SRAM chips made on the 45-nanometer process. The manufacturing technique will be used in mass manufacturing late next year. The test chips typically come out just under two years before mass manufacturing.

    Published: July 20, 2006 -- 15:59 GMT (08:59 PDT)

    Caption by: Bill Detwiler

  • 45nm test chip

    45nm test chip

    A 45-nanometer test chip. It can hold 153 megabits of memory. The top third consists of memory cells. The middle section contains circuits for input, output and other functions. Those transistors are made so that Intel can test how different transistors come out on the new process. The bottom part is a tester.

    Published: July 20, 2006 -- 15:59 GMT (08:59 PDT)

    Caption by: Bill Detwiler

  • transistor close-up

    transistor close-up

    A close-up of a memory cell made using the 45-nanometer process. Those horizontal lines are transistor gates.

    Published: July 20, 2006 -- 15:59 GMT (08:59 PDT)

    Caption by: Bill Detwiler

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  • 300mm wafer
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Photos: Intel's 45-nanometer process

A close look at test products made using Intel's 45-nanometer manufacturing technique.

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300mm wafer

A 300-millimeter wafer containing test SRAM chips made on the 45-nanometer process. The manufacturing technique will be used in mass manufacturing late next year. The test chips typically come out just under two years before mass manufacturing.

Published: July 20, 2006 -- 15:59 GMT (08:59 PDT)

Caption by: Bill Detwiler

Related Topics:

Intel Data Centers Servers Hardware Processors Security
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