The $250 million lab, dubbed RP1 for "research and pathfinding" will be used to forward development of photolithography, transistors, advanced interconnects and more "environmentally friendly" manufacturing processes, the company said.
The use of 300MM wafers is an important new development for Intel and the chipmaking industry as a whole. The larger new size, as compared to the current 200MM-wafer size, will allow chipmakers to produce more chips per wafer, increasing the manufacturing capacity of existing factories and therefore reducing the per-chip manufacturing costs. Intel produced its first chips based on 300MM wafers last April. --John G. Spooner, ZDNet News