Intel shows off new 22-nanometer wafer

Summary:At the Intel Developer Forum in San Francisco, Intel CEO Paul Otellini shows off a silicon wafer housing chips made with 22-nanometer process technology. Chips made on that process will be ready for market in 2011.

Topics: Intel, Hardware, Networking, Processors

Kick off your day with ZDNet's daily email newsletter. It's the freshest tech news and opinion, served hot. Get it.

Related Stories

The best of ZDNet, delivered

You have been successfully signed up. To sign up for more newsletters or to manage your account, visit the Newsletter Subscription Center.
Subscription failed.