At 6 centimeters square, VIA's new Mobile-ITX platform is half the size of its popular Pico-ITX model, but it still manages to squeeze in enough computing to handle next-generation embedded devices.
The Mobile-ITX platform sports a modularized design that includes a CPU module card and I/O carrier board. The modules are said to integrate "core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals."
Power consumption is just five watts -- that's always-on, mission-critical territory.
The first commercial Mobile-ITX-based CPU module is expected to appear in Q1 2010.