Last year, Microsoft jointly contributed with Facebook and Baidu the OCP Accelerator Module (OAM) specification to the OCP under the Open Accelerator Infrastructure (OAI) banner. The idea behind that contribution was to develop open, interoperable, modular infrastructure for emerging accelerators for artificial intelligence and high-performance computing. Last year, Microsoft also co-presented an early draft of the Datacenter-ready Secure Control Module (DC-SCM), which provides essential elements for a datacenter server motherboard, excluding CPU, memory slots and IO slots.
Microsoft is planning to contribute the DC-SCM/SCI base specification to the OCP, officials said today in Microsoft's blog post, and several original design manufacturers already are working to integrate DC-SCM into server solutions over time. Microsoft's next step will be to include the DC-SCM into the OAI specification as OAI-SCM.
Microsoft also is introducing the E.1S, which is a 1U and 2U chassis design optimized for Intel Cascade Lake-based and AMD Rome-based systems.
"We believe this new standard will help catalyze broader adoption across the enterprise by enabling smaller capacity increments and higher IOPS per GB, as well as easing cost constraints," officials said.
On the liquid cooling front, Microsoft is looking at how to extend this technology beyond current specific use cases, like bitcoin mining, to broader hyperscale cloud technology. Microsoft is working with OCP members, especially Facebook and CoolIT, to create standards for developing blind-mate Cold-Plate solutions for Project Olympus systems and Open Rack v3.
Finally, Microsoft also is working with ORv3 Power Shelf suppliers to deliver high-power racks and systems for global cloud infrastructure, officials said.