​Intel partners with eASIC for custom cloud silicon

Cloud computing likes fast hardware so Intel has partnered with eASIC to provided specialized silicon for cloud-sized jobs.
Written by Steven Vaughan-Nichols, Senior Contributing Editor

On May 12, Intel announced that it would develop integrated products with eASIC that combine superior processing performance and customizable hardware for data centers and the cloud.

The companies promise that these new components will be up up to two times faster than standard field programmable gate array (FPGA) for workloads like security and big data analytics. At the same time, they claim that the products will speed the time to market for custom application-specific integrated circuit (ASIC) development by as much as 50 percent.

To make this happen, eASIC will integrate its chip technology with upcoming Intel Xeon processors. Thus, by integrating hardware accelerator solutions with the eASIC platform, Intel can deliver much faster and more flexible cloud and data-center servers.

This follows up on Intel's announcement of the Xeon processor E7-8800/4800 v3 product families. These new Xeon chips come with up to 18 cores.

"Having the ability to highly customize our solutions for a given workload will not only make the specific application run faster, but also help accelerate the growth of exciting new applications like visual search," said Diane Bryant, senior vice president and general manager of Intel's Data Center Group in a statement.

This collaboration is part of Intel's strategy to integrate re-programmable technology with its Xeon processors to improve performance, power and cost.

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