Samsung on Tuesday laid out a plan to ramp up its production of advanced semiconductors, aiming to mass-produce 1.4-nanometer (nm) chips by 2027. The tech giant is working to meet the demand for cutting-edge chips for high-performance computing, AI, 5G, 6G, and automotive applications.
On top of that, the company plans to expand its production capacity for the advanced nodes by more than three times by 2027 compared with this year. By 2027, Samsung expects non-mobile applications -- like HPC, automotive, and 5G applications -- to make up more than half of its foundry portfolio.
Samsung plans to improve its gate-all-around (GAA)-based 3nm process support for HPC and mobile chips. The company also plans to diversify the 4nm process specialized for HPC and automotive applications.