Samsung Electronics has begun mass producing embedded package-on-package (ePoP) memory for smartphones that combines a dynamic random-access memory (DRAM) and NAND flash, the company said.
The South Korean tech giant last year began producing ePoP for wearables. It grouped the controller, DRAM, and NAND flash into one chip that could be stacked above an application processor, thus conserving space. As NAND flashes are sensitive to heat, having it close to APs that process at a high temperature was previously thought to be difficult.
The newly launched ePoP for smartphones can be grouped into a package with APs and take up as much as 40 percent less space, allowing for slimmer handset designs.
ePoP also has very high capacity and reading speeds, as it groups a 3GB LPDDR3 mobile DRAM module with a 32GB embedded multimedia card. It is 64 bits wide, and the DRAMs are made through a 20-nanometre process.
Samsung secured a full line-up of 20-nanometre memory products late last year, and said in its fourth-quarter guidance that its memory business will grow at a higher rate than the market average in the coming year.
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