Via has open sourced its designs for its OpenBook, a device that promises to usher in a new breed of ultra mobile personal computing devices. The game for Via is simple: Give away designs to sell chips and motherboards. Here's a look at the CAD 3D image of the casing for the OpenBook.
The casing for the keyboard.
CAD image showing the screen hinge.
CAD image of screen casing.
Bottom casing 3D image.
Put all the plastic together and you get this.
Another model of everything being put together.
With some shine--not to mention manufacturing ability--you wind up with a shiny device.
Another shot of the completed product.
Here's what you get when finished.