Samsung Electronics has successfully applied 3D stacking technology on a test chip that was made using the 7nm extreme ultraviolet (EUV) chip making process, the company said on Thursday.
Dubbed extended cube (X-Cube), Samsung used the technology to stack the SRAM on top of a logic die. This differs from the conventional method where SRAM, which is used for cache memory, is placed on the same plane next to logic chips such as CPU and GPU.
The South Korean tech giant said the technology will allow customers to design chips that take up less space.
Samsung will also apply its TSV technology in which the wires for the memory layer and the logic layer are connected through tiny holes instead of around the controller to increase speed, lower power consumption, and allow the chips to be packed in a more compact manner.
The ultra-thin package design offered by these technologies also allow the chips to have shorter signal paths between the dies to maximise data transfer speed and energy efficiency, Samsung added.