Samsung Electronics has begun production of its Eyxnos 9810 application processor with boosted artificial intelligence (AI) features, the company announced.
The octa-core processor has four 2.9GHz cores. Samsung's own CPU design has improved the data pipeline and cache memory that is claimed to double single core capability and increase multi-core features by 40 percent.
The chip's neural network-based deep-learning feature allows it to process and classify images saved on the device faster.
Its 3D scanning allows for facial recognition, and comes with a separate security processing unit to manage face, iris, and fingerprint information, Samsung said.
The chip, through "intelligent image processing", allows for a real-time out-of-focus feature, and filming and capturing of high-quality images in the dark and while on the move.
It supports 120fps, 4K UHD video, and 10-bit high-efficiency video coding (HEVC) and VP9 for 1 billion colours.
The chip supports Cat.18 6CA (carrier aggregation) that will allow download speeds of up to 1.2Gbps and upload speed of 200Mbps. It has a 4x4 Multiple-Input Multiple-Output (MIMO) multi-antenna and enhanced Licensed Assisted Access (LAA) technology that will allow it to access unlicensed spectrum, Bluetooth, and Wi-Fi.
It was created with Samsung's second generation 10-nanometre process.
Along with Qualcomm's Snapdragon 845, which also uses the process, the chips will likely power the upcoming Galaxy S9 phones.
Samsung moved from 14-nanometre to 10-nanometre for flagship phones last year. It could migrate to 8 nanometres as early as the second half of 2018.
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